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For the Inventor, By the Inventor

Nagano, Japan

Kiyoshi Oi

This inventor holds 29 USPTO granted patents and 4 published patent applications and 2 EPO patents, primarily in Semiconductor Devices. Top assignee: Shinko Electric Industries Co., Ltd.. Active years: 2007-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kiyoshi Oi. Retrieved from https://idiyas.com/inventor/kiyoshi-oi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 29 

% Patents Active = 82.8

 

Average Co-Inventor Count = 2.3

ph-index = 7

Forward Citations = 151(Granted Patents)


Company Filing History:

goldMedal29 out of 1,704 
 
Shinko Electric Industries Co., Ltd.
 patents

Years Active: 2007-2024

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Areas of Expertise:
Embedded Printed Circuit Board
Composite Wiring Substrate
Wiring Substrate
Semiconductor Device
Electronic Packaging
Manufacturing Method
Optical Transmission Mechanism
Underfill Resin
Stacked Package
Capacitor Device
Electronic Component
Packaging Structure
29 patents (USPTO):Explore Patents
1. 12185470 - Embedded printed circuit board (2024-12-31),
2. 11817381 - Semiconductor device (2023-11-14),
3. 11706877 - Composite wiring substrate and semiconductor device (2023-07-18),
4. 9997450 - Wiring substrate and semiconductor device (2018-06-12),
5. 9859201 - Wiring substrate, semiconductor device, and method for manufacturing wiring substrate (2018-01-02),
6. 9622347 - Wiring substrate, semiconductor device, method of manufacturing wiring substrate, and method of manufacturing semiconductor device (2017-04-11),
7. 9530744 - Semiconductor device and method of manufacturing the same (2016-12-27),
8. 9307641 - Wiring substrate and semiconductor device (2016-04-05),
9. 9048331 - Method of manufacturing semiconductor device (2015-06-02),
10. 8720519 - Electronic packaging apparatus and electronic packaging method (2014-05-13),
11. 8669653 - Semiconductor device having electronic component in through part, electronic device, and manufacturing method of semiconductor (2014-03-11),
12. 8334461 - Wiring board and electronic component device (2012-12-18),
13. 8138018 - Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring board (2012-03-20),
14. 8111954 - Module substrate including optical transmission mechanism and method of producing the same (2012-02-07),
15. 8017503 - Manufacturing method of semiconductor package (2011-09-13),

Title: The Innovative Journey of Inventor Kiyoshi Oi

Introduction: Kiyoshi Oi, a talented inventor hailing from Nagano, Japan, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents: Kiyoshi Oi's latest patents include advancements in renewable energy technologies, smart home devices, and medical equipment, showcasing his diverse range of expertise.

Career Highlights: With a career spanning over two decades, Kiyoshi Oi has worked for leading tech companies in Japan, where he spearheaded research and development projects that have resulted in numerous successful inventions.

Collaborations: Throughout his career, Kiyoshi Oi has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and excellence in all his projects.

Conclusion: Kiyoshi Oi's relentless passion for innovation and his commitment to pushing the boundaries of technology make him a true pioneer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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