The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 13, 2014
Filed:
May. 27, 2011
Takatoyo Yamakami, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Takashi Kubota, Kawasaki, JP;
Kiyoshi Oi, Nagano, JP;
Kiyoaki Iida, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Takatoyo Yamakami, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Takashi Kubota, Kawasaki, JP;
Kiyoshi Oi, Nagano, JP;
Kiyoaki Iida, Nagano, JP;
Takashi Kurihara, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Abstract
A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.