Chikuma, Japan

Takashi Kubota

This inventor holds 36 USPTO granted patents and 8 published patent applications and 1 EPO patent, primarily in Optical Modules. Top assignees: Fujitsu Corporation, Hitachi, Ltd., Fujitsu Limited Kawasaki. Active years: 1976-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takashi Kubota. Retrieved from https://idiyas.com/inventor/takashi-kubota

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 36 

% Patents Active = 47.2


Average Co-Inventor Count = 3.3

ph-index = 9

Forward Citations = 226(Granted Patents)


Location History:

  • Katsuta, JA (1976)
  • Mito, JP (1982 - 1988)
  • Kawasaki, JP (1995 - 2014)
  • Chikuma, JP (2014 - 2020)

Company Filing History:


Years Active: 1976-2020

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Areas of Expertise:
Optical Module
Semiconductor Device
Electronic Packaging
Optical Waveguide
Bonding Method
RFID Tag
Flip-Chip Mounting
Hard Disk Drive
Moving Body Recognition
Integrated Filter Circuit
Magnetic Recording
Video Signal
36 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Takashi Kubota

Introduction: Takashi Kubota, an esteemed inventor from Chikuma, Japan, has made significant strides in the field of technology with an impressive portfolio of 36 patents. His work primarily focuses on advancements in semiconductor technology and optical modules, reflecting his commitment to innovation in these crucial sectors.

Latest Patents: Among his most recent inventions are the "Composite Bump" and "Method for Forming Composite Bump" patents. The composite bump innovation consists of multiple first bumps, which are metal-bonded to an electrode pad of a semiconductor chip, along with a second bump that is bonded to these first bumps. This method for forming such bumps enhances the reliability and efficiency of semiconductor devices. Additionally, his patent for an "Optical Module" describes a sophisticated device that includes a substrate with a through hole, featuring a first chip with a heating member and a second chip bonded to both the substrate and the first chip. This design improves thermal management and performance in optical applications.

Career Highlights: Takashi's professional journey includes notable tenures at prominent companies such as Fujitsu Corporation and Hitachi, Ltd. His experiences at these establishments have significantly influenced his innovative capabilities, allowing him to delve deeper into semiconductor and optical technologies.

Collaborations: Throughout his career, Takashi has collaborated with esteemed colleagues like Hidehiko Kira and Kenji Kobae. These partnerships have fostered an exchange of ideas and expertise, contributing to the success of numerous projects and patents.

Conclusion: Takashi Kubota stands out as a remarkable inventor whose work continues to shape the future of technology in Japan and beyond. His contributions, particularly in the fields of semiconductor devices and optical modules, underscore the importance of innovation in driving advancements and meeting the demands of modern technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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