The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 21, 2020
Filed:
May. 10, 2018
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 29/41 (2006.01); H05K 3/34 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 24/13 (2013.01); H01L 29/41 (2013.01); H01L 24/11 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05624 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/1134 (2013.01); H01L 2224/11901 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/1308 (2013.01); H01L 2224/13012 (2013.01); H01L 2224/13015 (2013.01); H01L 2224/13017 (2013.01); H01L 2224/13078 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81205 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/81903 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/3656 (2013.01); H05K 3/328 (2013.01); H05K 3/3436 (2013.01);
Abstract
A composite bump includes a plurality of first bumps that is metal-bonded to an electrode pad of a semiconductor chip, and a second bump that is metal-bonded to the plurality of first bumps. A method for forming a composite bump, includes forming a plurality of first bumps to be metal-bonded to an electrode pad of a semiconductor chip, and forming a second bump to be metal-bonded to the plurality of first bumps.