The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2020

Filed:

Nov. 05, 2018
Applicant:

Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;

Inventors:

Takayoshi Matsumura, Yokohama, JP;

Naoaki Nakamura, Kawasaki, JP;

Norio Kainuma, Nagano, JP;

Takashi Kubota, Chikuma, JP;

Kenji Fukuzono, Kawasaki, JP;

Takumi Masuyama, Kawasaki, JP;

Yuki Hoshino, Yokohama, JP;

Hidehiko Kira, Nagano, JP;

Assignee:

FUJITSU LIMITED, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/538 (2006.01); H01S 5/02 (2006.01); H01L 23/367 (2006.01); H01L 25/075 (2006.01); H01S 5/022 (2006.01); H01L 23/00 (2006.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5384 (2013.01); G02B 6/4269 (2013.01); H01L 23/3677 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 23/562 (2013.01); H01L 25/0756 (2013.01); H01S 5/0216 (2013.01); H01S 5/02276 (2013.01);
Abstract

An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.


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