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For the Inventor, By the Inventor

Kawasaki, Japan

Kenji Fukuzono

This inventor holds 26 USPTO granted patents and 10 published patent applications, primarily in Semiconductor Packaging. Top assignee: Fujitsu Corporation. Active years: 2005-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kenji Fukuzono. Retrieved from https://idiyas.com/inventor/kenji-fukuzono

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 

% Patents Active = 23.1

Average Co-Inventor Count = 2.4

ph-index = 5

Forward Citations = 66(Granted Patents)


Company Filing History:

goldMedal26 out of 39,378 
 
Fujitsu Corporation
 patents

Years Active: 2005-2020

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Areas of Expertise:
Optical Module
BGA Package Substrate
Semiconductor Apparatus
Printed Circuit Board
Packaging Structure
Electronic Device
Wiring Board Unit
Heat Radiation Member
Multilayer Board
Adhesive Sealing
Manufacturing Method
Circuit Board
26 patents (USPTO):Explore Patents
1. 10586770 - Optical module (2020-03-10),
2. 10444450 - Optical module (2019-10-15),
3. 10418310 - BGA package substrate and method of manufacturing the same (2019-09-17),
4. 10261249 - Optical module and method of manufacturing optical module (2019-04-16),
5. 10181437 - Package substrate and method of manufacturing package substrate (2019-01-15),
6. 9515005 - Package mounting structure (2016-12-06),
7. 9362202 - Electronic device and method for manufacturing same (2016-06-07),
8. 9006876 - Semiconductor apparatus and manufacturing method thereof (2015-04-14),
9. 8933558 - Semiconductor package, wiring board unit, and electronic apparatus (2015-01-13),
10. 8866270 - Method of manufacturing semiconductor device mounting structure (2014-10-21),
11. 8716839 - Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus (2014-05-06),
12. 8642896 - Printed circuit board, printed circuit board fabrication method, and electronic device including printed circuit board (2014-02-04),
13. 8168471 - Semiconductor device and manufacturing method of a semiconductor device (2012-05-01),
14. 8152953 - Method of making printed wiring board and method of making printed circuit board unit (2012-04-10),
15. 8119923 - Circuit board (2012-02-21),

Title: Kenji Fukuzono - Pioneering Inventor from Kawasaki, JP

Introduction: Kenji Fukuzono is a renowned inventor hailing from Kawasaki, Japan, known for his groundbreaking contributions to various technological fields.

Latest Patents: Kenji Fukuzono holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Kenji Fukuzono has worked with leading research institutions and tech companies, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Kenji Fukuzono has collaborated with top engineers, scientists, and designers from around the world, fostering a culture of innovation and excellence in all his projects.

Conclusion: Kenji Fukuzono's passion for innovation and his relentless drive to push the boundaries of technology make him a true pioneer in the world of inventions, with a lasting impact on society and the future of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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