The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 21, 2012
Filed:
Aug. 08, 2008
Hideaki Yoshimura, Kawasaki, JP;
Kenji Fukuzono, Kawasaki, JP;
Kenji Iida, Kawasaki, JP;
Tomoyuki Abe, Kawasaki, JP;
Yasutomo Maehara, Kawasaki, JP;
Takashi Nakagawa, Kawasaki, JP;
Shin Hirano, Kawasaki, JP;
Takashi Kanda, Kawasaki, JP;
Hideaki Yoshimura, Kawasaki, JP;
Kenji Fukuzono, Kawasaki, JP;
Kenji Iida, Kawasaki, JP;
Tomoyuki Abe, Kawasaki, JP;
Yasutomo Maehara, Kawasaki, JP;
Takashi Nakagawa, Kawasaki, JP;
Shin Hirano, Kawasaki, JP;
Takashi Kanda, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.