The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2019
Filed:
Oct. 17, 2017
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H05K 3/46 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); G02B 6/42 (2006.01); H05K 3/34 (2006.01); G02B 6/122 (2006.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01); G02B 6/122 (2013.01); G02B 6/428 (2013.01); G02B 6/4272 (2013.01); G02B 6/4283 (2013.01); H05K 1/0204 (2013.01); H05K 1/0274 (2013.01); H05K 1/181 (2013.01); H05K 3/3436 (2013.01); H05K 3/4626 (2013.01); H05K 3/4697 (2013.01); G02B 2006/12121 (2013.01); G02B 2006/12123 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10151 (2013.01); H05K 2201/10734 (2013.01);
Abstract
An optical module includes a first board that includes a recessed portion and a first conductor layer, a second board accommodated in the recessed portion and includes an optical waveguide and a second conductor layer, a semiconductor element installed across the first board and the second board and coupled to the first conductor layer and the second conductor layer, and a first bonding material disposed between a sidewall and a bottom surface of the recessed portion and the second board so as to bond the first board and the second board to each other.