Fujitsu Corporation

Kenji Fukuzono

Takashi Kanda

Manabu Watanabe

Masateru Koide

Yuki Hoshino

Hideaki Yoshimura

Takashi Nakagawa

Shunji Baba

Norio Kainuma

Naoaki Nakamura

Tomohisa Yagi

Yasuhiro Usui

Hidehiko Kira

Takayoshi Matsumura

Takashi Kubota

Kenji Iida

Yasutomo Maehara

Misao Umematsu

Takumi Masuyama

Hitoshi Suzuki

Tomoyuki Abe

Makoto Suwada

Nobuhiro Imaizumi

Hiroaki Date

Shin Hirano

Kaoru Sugimoto

Seiichi Sugano

An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.

Optical module

An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.

A BGA package substrate includes a substrate, a resist formed over the substrate and includes an opening, a land formed over the substrate in the opening, and a solder ball fused to the land, wherein the resist includes a notch at an edge of the opening through which the land is exposed, the notch having a bottom at a position lower than a surface of the land.

BGA package substrate and method of manufacturing the same

An optical module includes a first board that includes a recessed portion and a first conductor layer, a second board accommodated in the recessed portion and includes an optical waveguide and a second conductor layer, a semiconductor element installed across the first board and the second board and coupled to the first conductor layer and the second conductor layer, and a first bonding material disposed between a sidewall and a bottom surface of the recessed portion and the second board so as to bond the first board and the second board to each other.

Optical module and method of manufacturing optical module

A package substrate includes a substrate, a first connection terminal mounted over the substrate, the first connection terminal including a first land and a second land on the substrate, a first solder resist surrounding the first land and the second land, and a first solder ball formed straddling the first land and the second land; and a second connection terminal which is mounted over the substrate and disposed adjacent to the first connection terminal, the second connection terminal including a third land and a fourth land on the substrate, a second solder resist surrounding the third land and the fourth land, and a second solder ball formed straddling the third land and the fourth land.

Package substrate and method of manufacturing package substrate

A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate.

Package mounting structure

An electronic device includes: a support member; an electronic component stacked over the support member with a plurality of connections therebetween; and a refrigerant pipe through which a refrigerant passes, the refrigerant pipe being provided between at least some connections among the plurality of connections. A method for manufacturing an electric device includes: stacking an electronic component over a support member with a plurality of connections therebetween; and providing a refrigerant pipe, through which a refrigerant passes, between at least some connections among the plurality of connections.

Electronic device and method for manufacturing same

A semiconductor apparatus includes: a package substrate on which a semiconductor device is disposed; a mounting board over which the package substrate is mounted; a first restraint that penetrates through the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are separated from each other; and a second restraint that is disposed between the mounting board and the package substrate, and restrains deformation of the mounting board and the package substrate in a direction in which the mounting board and the package substrate are closer to each other.

Semiconductor apparatus and manufacturing method thereof

A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, includes: a package board; a heating element which is mounted on the package board; a chip part which is mounted on the package board and provided around the heating element; and a heat transfer element having a main body unit which is jointed to the heating element with a metal joint material and a leg part which extends from the main body part to the package board and of which a tip is attached to the package board, and wherein the leg part, comprising: a first leg part allocated in a corner of the package board; and a second leg part which is allocated inside the first leg part between the heating element and the chip part on the package board.

Semiconductor package, wiring board unit, and electronic apparatus

A semiconductor device mounting structure includes: a substrate with an opening provided therein; a frame member with a frame body and a protruding portion that protrudes from the frame body, the frame body being formed and accommodated in a groove around the opening; a coreless substrate provided above the substrate and supported by the protruding portion of the frame member; and semiconductor elements provided on the coreless substrate.

Method of manufacturing semiconductor device mounting structure

Semiconductor device mounting structure, method of manufacturing the same, and electronic apparatus

A printed circuit board include: a printed circuit board main body having a mounting area on a first surface of the printed circuit board main body and a recess being provided at a recess area on a second surface that is a back side of the first surface of the printed circuit board main body, the electronic component being mounted on the mounting area, the recess area being provided to correspond to the mounting area; and a thermal expansion control element being placed in the recess and having a smaller thermal expansion coefficient than the printed circuit board main body.

Printed circuit board, printed circuit board fabrication method, and electronic device including printed circuit board

A semiconductor device includes a multi-layer substrate and a semiconductor element mounted on the multi-layer substrate. The multi-layer substrate contains a plurality of circuit-formation layers joined by a first resin material. The semiconductor element is mounted on the multi-layer substrate by being joined to the multi-layer substrate by a second resin material. The first resin material and the second resin material are curable in the same heating condition.

Semiconductor device and manufacturing method of a semiconductor device

The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.

Method of making printed wiring board and method of making printed circuit board unit

A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

Growing community of inventors

Kawasaki, Japan

Kenji Fukuzono