The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 10, 2012

Filed:

Feb. 04, 2009
Applicants:

Hideaki Yoshimura, Kawasaki, JP;

Takashi Nakagawa, Kawasaki, JP;

Kenji Fukuzono, Kawasaki, JP;

Takashi Kanda, Kawasaki, JP;

Tomohisa Yagi, Kawasaki, JP;

Inventors:

Hideaki Yoshimura, Kawasaki, JP;

Takashi Nakagawa, Kawasaki, JP;

Kenji Fukuzono, Kawasaki, JP;

Takashi Kanda, Kawasaki, JP;

Tomohisa Yagi, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

The first support body is pressed against the second support body in response to the softening of the adhesive sheet. The fillers are allowed to reliably contact with one another between the first electrically-conductive land and the second electrically-conductive land. The fillers melt after the adhesive sheet has been softened. The intermetallic compounds are formed between the fillers and the electrically-conductive lands and between the fillers. Electrical connection is in this manner established between the first electrically-conductive land and the second electrically-conductive land. The matrix material and the adhesive sheet are then cured. The first support body and the second support body are firmly bonded to each other.


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