The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Jun. 13, 2018
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Yuki Hoshino, Yokohama, JP;
Kenji Fukuzono, Kawasaki, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); B23K 1/00 (2006.01); B23K 1/20 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); B23K 1/0016 (2013.01); B23K 1/203 (2013.01); B23K 3/0623 (2013.01); B23K 3/08 (2013.01); H01L 21/4853 (2013.01); H01L 23/49838 (2013.01); H05K 1/115 (2013.01); B23K 2101/40 (2018.08); H01L 2924/15151 (2013.01);
Abstract
A BGA package substrate includes a substrate, a resist formed over the substrate and includes an opening, a land formed over the substrate in the opening, and a solder ball fused to the land, wherein the resist includes a notch at an edge of the opening through which the land is exposed, the notch having a bottom at a position lower than a surface of the land.