The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Aug. 24, 2012
Manabu Watanabe, Yokohama, JP;
Kenji Fukuzono, Kawasaki, JP;
Manabu Watanabe, Yokohama, JP;
Kenji Fukuzono, Kawasaki, JP;
Fujitsu Limited, Kawsaki, JP;
Abstract
A semiconductor package which is allocated between a wiring board and a cooling member, the semiconductor package, includes: a package board; a heating element which is mounted on the package board; a chip part which is mounted on the package board and provided around the heating element; and a heat transfer element having a main body unit which is jointed to the heating element with a metal joint material and a leg part which extends from the main body part to the package board and of which a tip is attached to the package board, and wherein the leg part, comprising: a first leg part allocated in a corner of the package board; and a second leg part which is allocated inside the first leg part between the heating element and the chip part on the package board.