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For the Inventor, By the Inventor

Kawasaki, Japan

Takatoyo Yamakami

USPTO Granted Patents = 17 

Average Co-Inventor Count = 5.0

ph-index = 7

Forward Citations = 110(Granted Patents)


Location History:

  • Kawasaki, JP (2002 - 2014)
  • Nagano, JP (2014 - 2017)

Company Filing History:

goldMedal16 out of 39,228 
 
Fujitsu Corporation
 patents
silverMedal1 out of 1,694 
 
Shinko Electric Industries Co., Ltd.
 patents

Years Active: 2002-2017

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17 patents (USPTO):Explore Patents
1. 9615464 - Method of mounting semiconductor element, and semiconductor device (2017-04-04),
2. 9266312 - Bonding apparatus and bonding method (2016-02-23),
3. 9195003 - Optical unit in which optical element is mounted on base having optical wave guide and method of manufacturing the same (2015-11-24),
4. 8861903 - Method of manufacturing optical waveguide device and optical waveguide device (2014-10-14),
5. 8720519 - Electronic packaging apparatus and electronic packaging method (2014-05-13),
6. 8418910 - Electroconductive bonding material, method for bonding conductor, and method for manufacturing semiconductor device (2013-04-16),
7. 7699235 - RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of manufacturing RFID tag (2010-04-20),
8. 7540428 - RFID tag, RFID-tag antenna, RFID-tag antenna sheet, and method of manufacturing RFID tag (2009-06-02),
9. 7394163 - Method of mounting semiconductor chip (2008-07-01),
10. 7363704 - RFID tag and method of manufacturing RFID tag (2008-04-29),
11. 7347347 - Head assembly, disk unit, and bonding method and apparatus (2008-03-25),
12. 7196512 - Magnetic head tester (2007-03-27),
13. 7133733 - Design support system (2006-11-07),
14. 6885522 - Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation (2005-04-26),
15. 6770319 - Resin coating method (2004-08-03),

Title: Takatoyo Yamakami: Innovator in Semiconductor Technology

Introduction

Takatoyo Yamakami is a prominent inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 17 patents. His innovative approaches have paved the way for advancements in semiconductor mounting and bonding techniques.

Latest Patents

Yamakami's latest patents include a method of mounting semiconductor elements and a bonding apparatus. The method of mounting involves attaching a first solder joint material onto a substrate and supplying a second solder joint material with a lower melting point. This innovative technique allows for precise arrangement and reflow processes that enhance the reliability of semiconductor devices. The bonding apparatus he developed features a light source, a stage, and a component holder made of light-transparent material. This apparatus is designed to bond components using photo-curing adhesives, showcasing Yamakami's commitment to advancing semiconductor manufacturing processes.

Career Highlights

Throughout his career, Takatoyo Yamakami has worked with notable companies such as Fujitsu Corporation and Shinko Electric Industries Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the semiconductor industry.

Collaborations

Yamakami has collaborated with esteemed colleagues, including Hidehiko Kira and Hiroshi Kobayashi. These partnerships have fostered a creative environment that has led to the development of innovative solutions in semiconductor technology.

Conclusion

Takatoyo Yamakami's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor manufacturing and bonding techniques.

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