The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2008
Filed:
Jul. 03, 2002
Shunji Baba, Kawasaki, JP;
Takatoyo Yamakami, Kawasaki, JP;
Norio Kainuma, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Hiroshi Kobayashi, Kawasaki, JP;
Shunji Baba, Kawasaki, JP;
Takatoyo Yamakami, Kawasaki, JP;
Norio Kainuma, Kawasaki, JP;
Kenji Kobae, Kawasaki, JP;
Hidehiko Kira, Kawasaki, JP;
Hiroshi Kobayashi, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill is made to have a preferable shape. To accomplish this, a head IC chip provided with bumps is placed on a suspension that is covered with the underfill adhesive and is provided with pads. A bonding tool presses the head IC chip and applies ultrasonic oscillation to the head IC chip, so that the bumps are properly bonded to the pads. When the head IC chip is pressed and subjected to ultrasonic oscillation, the ultraviolet raysare emitted so as to harden the peripheral portionof the adhesivespread out between the head IC chipand the suspension