The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2017
Filed:
Dec. 05, 2014
Shinko Electric Industries Co., Ltd., Nagano-shi, JP;
Kiyoshi Oi, Nagano, JP;
Takashi Kurihara, Nagano, JP;
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-shi, JP;
Abstract
A wiring substrate includes a first multi-layer wiring layer having a stacked via structure including a first electrode pad, a second multi-layer wiring layer having a non-stacked via structure including a second electrode pad. The second electrode pad is formed on an uppermost first insulating layer. The first electrode pad is formed on a second insulating layer which is located to a position lower by one layer than the first insulating layer, and the first electrode pad is arranged in an opening portion of the first insulating layer such that the upper face and the side face of the first electrode pad are exposed.