The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2011
Filed:
Sep. 27, 2010
Kiyoshi Oi, Nagano, JP;
Toru Hizume, Nagano, JP;
Fumimasa Katagiri, Tempe, AZ (US);
Akihiko Tateiwa, Nagano, JP;
Kiyoshi Oi, Nagano, JP;
Toru Hizume, Nagano, JP;
Fumimasa Katagiri, Tempe, AZ (US);
Akihiko Tateiwa, Nagano, JP;
Shinko Electric Industries Co., Ltd., Nagano, JP;
Abstract
A manufacturing method includes forming a semi-cured insulation layer made of a photosensitive material on a supporting body; forming an opening part in the insulation layer by a photolithography method, the opening part being configured to expose the supporting body; arranging a semiconductor chip on the insulation layer so that a position of an electrode of the semiconductor chip is consistent with a position of the opening part, and curing the insulation layer; forming sealing resin on a surface of the insulation layer at the semiconductor chip side, the sealing resin being configured to seal the semiconductor chip; removing the supporting body; and providing a wiring layer on a surface of the insulation layer opposite to the semiconductor chip side, the wiring layer being electrically connected to the electrode exposed in the opening part, so that a wiring structural body including the insulation layer and the wiring layer is formed.