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For the Inventor, By the Inventor

Tsukuba, Japan

Kinya Ichikawa

USPTO Granted Patents = 18

Average Co-Inventor Count = 2.6

ph-index = 9

Forward Citations = 558(Granted Patents)


Location History:

  • Ohgaki, JP (1998)
  • Chiba, JP (1997 - 2000)
  • Tsuchiura, JP (2004)
  • Ibaraki-ken, JP (2003 - 2012)
  • Tsukuba, JP (2006 - 2017)

Company Filing History:

goldMedal18 out of 54,750 
 
Intel Corporation
 patents

Years Active: 1997-2017

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18 patents (USPTO):Explore Patents
1. 9741664 - High density substrate interconnect formed through inkjet printing (2017-08-22),
2. 9685388 - Picture frame stiffeners for microelectronic packages (2017-06-20),
3. 9502368 - Picture frame stiffeners for microelectronic packages (2016-11-22),
4. 9349703 - Method for making high density substrate interconnect using inkjet printing (2016-05-24),
5. 9263329 - Methods of connecting a first electronic package to a second electronic package (2016-02-16),
6. 8110920 - In-package microelectronic apparatus, and methods of using same (2012-02-07),
7. 7495330 - Substrate connector for integrated circuit devices (2009-02-24),
8. 7345361 - Stackable integrated circuit packaging (2008-03-18),
9. 7132739 - Encapsulated stack of dice and support therefor (2006-11-07),
10. 7132311 - Encapsulation of a stack of semiconductor dice (2006-11-07),
11. 7097462 - Patch substrate for external connection (2006-08-29),
12. 7005729 - Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame (2006-02-28),
13. 6838313 - Molded flip chip package (2005-01-04),
14. 6785148 - Easy mount socket (2004-08-31),
15. 6632704 - Molded flip chip package (2003-10-14),

Title: The Visionary Inventor: Kinya Ichikawa

Introduction:

Kinya Ichikawa, a man of relentless innovation and passion for pushing technological boundaries, stands out as a visionary inventor in the realm of inventions. Hailing from Tsukuba, Japan, Ichikawa has made significant contributions to the world of technology with his groundbreaking patents and inventions.

Latest Patents:

Ichikawa's latest patents showcase his expertise and creativity in revolutionizing the field of technology. "High density substrate interconnect formed through inkjet printing" introduces systems and apparatuses with dense interconnect bridges, while "Picture frame stiffeners for microelectronic packages" addresses reducing warpage in microelectronic packages. These patents underscore Ichikawa's commitment to cutting-edge solutions in the industry.

Career Highlights:

With an impressive portfolio of 18 patents, Kinya Ichikawa has established himself as a leading figure in the technology sector. His work at Intel Corporation, a global tech giant, has been instrumental in shaping advancements in microelectronics and substrate interconnect technologies. Ichikawa's innovative spirit and dedication to excellence have set the bar high for aspiring inventors worldwide.

Collaborations:

In the dynamic world of technology, collaboration is key to driving innovation forward. Ichikawa has had the privilege of working alongside esteemed colleagues such as Robert L Sankman and Jiro Kubota. Together, they have synergized their expertise to tackle complex challenges and deliver cutting-edge solutions in the field of technology.

Conclusion:

In conclusion, Kinya Ichikawa's pioneering spirit, coupled with his remarkable contributions to the world of inventions, cements his status as a true visionary. His patents and inventions not only demonstrate his technical prowess but also reflect his unwavering commitment to pushing the boundaries of innovation. Ichikawa's impact resonates far and wide, inspiring future generations of inventors to dream big and redefine what is possible in the ever-evolving landscape of technology.

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