The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 24, 2016
Filed:
Sep. 25, 2013
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 24/18 (2013.01); H01L 21/4867 (2013.01); H01L 23/5381 (2013.01); H01L 23/5385 (2013.01); H01L 24/24 (2013.01); H01L 25/0655 (2013.01); H05K 3/4694 (2013.01); H01L 21/486 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81801 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H05K 1/113 (2013.01); H05K 3/3436 (2013.01); H05K 3/4664 (2013.01); H05K 2203/013 (2013.01);
Abstract
Generally discussed herein are systems and apparatuses that include a dense interconnect bridge and techniques for making the same. According to an example a technique can include creating a multidie substrate, printing an interconnect bridge on the multidie substrate, electrically coupling a first die to a second die by coupling the first and second dies through the interconnect bridge.