The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2003
Filed:
Dec. 19, 2000
Applicant:
Inventors:
Takashi Kumamoto, Ibaraki-ken, JP;
Kinya Ichikawa, Ibaraki-ken, JP;
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A method for producing a molded flip chip package is described. The incomplete flip chip package comprising a thin substrate and a silicon chip is placed in a mold. A resin, preferably epoxy, is injected into the mold filling the gap between the surface of the flip chip and the adjacent substrate. Additionally, a stiffening structure is formed to increase the overall rigidity of the thin substrate specifically and the package as a whole.