The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2006
Filed:
Jul. 26, 2002
Masayuki Akiba, Ibaraki-ken, JP;
Kinya Ichikawa, Ibaraki-ken, JP;
Jiro Kubota, Ibaraki-ken, JP;
Takashi Kumamoto, Ibaraki-ken, JP;
Masayuki Akiba, Ibaraki-ken, JP;
Kinya Ichikawa, Ibaraki-ken, JP;
Jiro Kubota, Ibaraki-ken, JP;
Takashi Kumamoto, Ibaraki-ken, JP;
Intel Corporation, Santa Clara, CA (US);
Abstract
Systems and methods for encapsulating a stack of semiconductor dice are described. A stack of semiconductor dice may be formed, for example by attaching die to flexible printed circuit supports attached to frames and stacking the supports, and then encapsulated by flowing a liquid encapsulant around the stack of dice and solidifying the liquid encapsulant. The die supports may contain encapsulant flow openings, such as rectangular slits, that allow the liquid encapsulant to flow around the stack of dice.