The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2008
Filed:
Dec. 04, 2003
Debendra Mallik, Chandler, AZ (US);
Kinya Ichikawa, Tsukuba, JP;
Terry L. Sterrett, Cave Creek, AZ (US);
Johanna Swan, Scottsdale, AZ (US);
Debendra Mallik, Chandler, AZ (US);
Kinya Ichikawa, Tsukuba, JP;
Terry L. Sterrett, Cave Creek, AZ (US);
Johanna Swan, Scottsdale, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A system may include an integrated circuit die, an integrated circuit package coupled to the integrated circuit die, mold compound in contact with the integrated circuit die and the integrated circuit package, and an interconnect coupled to the integrated circuit package. A first portion of the interconnect may be in contact with the mold compound, a second portion of the interconnect might not contact the mold compound, and a third portion of the interconnect may be in contact with the integrated circuit package.