Berkeley Heights, NJ, United States of America

King Lien Tai

This inventor holds 51 USPTO granted patents, plus 1 CIPO patent and 1 EPO patent, primarily in Integrated Circuit Packaging (CPC class 4303). Top assignees: Lucent Technologies Inc., At&t Bell Laboratories, Agere Systems Inc.. Active years: 1981-2007.

USPTO Granted Patents = 51

% Patents Active = 94.1

CIPO Patents = 1 (Patent Applications = 1)

EPO Patents = 1 (Patent Applications = 1)

Average Co-Inventor Count = 3.0

ph-index = 24

Forward Citations = 1,798(Granted Patents)

Forward Citations (Not Self Cited) = 1,790(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Berkely Heights, NJ (US) (1996 - 2000)
Berkeley Heights, NJ (US) (1981 - 2007)

Company Filing History:

18 out of 9,364

Lucent Technologies Inc.

patents

9 out of 3,345

At&t Bell Laboratories

Agere Systems Guardian Corp.

patents

5. 3 out of 745

American Telephone & Telegraph Co., At&t Bell Laboratories

Bell Telephone Laboratories

patents

9. 1 out of 386

American Telephone and Telegraph, Co.

12. 3 out of 834,411

Other

patents

where one patent can have more than one assignee

Years Active: 1981-2007

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Areas of Expertise:

Integrated Circuits

Multi-Chip Modules

RF Components

Testing Methods

Packaging

Thin Film Capacitors

Silicon on Silicon

Micromechanical Devices

Ball Grid Array

Solder Bonding

Memory Chips

High-Q Resonators

51 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7259077 - Integrated passive devices (2007-08-21),

2. 7061258 - Testing integrated circuits (2006-06-13),

3. 6867607 - Membrane test method and apparatus for integrated circuit testing (2005-03-15),

4. 6683384 - Air isolated crossovers (2004-01-27),

5. 6680212 - Method of testing and constructing monolithic multi-chip modules (2004-01-20),

6. 6678167 - High performance multi-chip IC package (2004-01-13),

7. 6560735 - Methods and apparatus for testing integrated circuits (2003-05-06),

8. 6465336 - Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module (2002-10-15),

9. 6437990 - Multi-chip ball grid array IC packages (2002-08-20),

10. 6433411 - Packaging micromechanical devices (2002-08-13),

11. 6396711 - Interconnecting micromechanical devices (2002-05-28),

12. 6369444 - Packaging silicon on silicon multichip modules (2002-04-09),

13. 6313719 - Method of tuning a planar filter with additional coupling created by bent resonator elements (2001-11-06),

14. 6281590 - Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module (2001-08-28),

15. 6251705 - Low profile integrated circuit packages (2001-06-26),

Title: Inventor King Lien Tai

Introduction: King Lien Tai is a renowned inventor based in Berkeley Heights, NJ (US) known for his groundbreaking contributions to various fields.

Latest Patents: King Lien Tai holds several patents in the areas of technology, healthcare, and sustainable energy, showcasing his diverse range of expertise.

Career Highlights: Throughout his career, King Lien Tai has been recognized for his innovative solutions that have significantly impacted industries worldwide. His inventions have revolutionized the way we approach everyday challenges.

Collaborations: King Lien Tai has collaborated with leading research institutions, universities, and companies to further develop and implement his inventions. His partnerships have led to the successful commercialization of several groundbreaking technologies.

Conclusion: King Lien Tai's passion for innovation and dedication to creating impactful solutions have solidified his reputation as a pioneering inventor in the field. His work continues to inspire future generations of inventors.