The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2004
Filed:
Oct. 08, 1997
Dean Paul Kossives, Glen Gardner, NJ (US);
Fan Ren, Warren, NJ (US);
King Lien Tai, Berkeley Heights, NJ (US);
Agere Systems INC, Allentown, PA (US);
Abstract
The specification describes integrated circuit air isolated crossover interconnections designed for flip chip multi-chip module interconnection technology. The crossovers are made using a crossover interconnection substrate separate from the interconnection substrate of the integrated circuit. In one embodiment the integrated circuit is flip chip bonded to a multi-chip or multi-component interconnection substrate, and the crossover interconnections are made through solder bumps or balls soldered to a conductive layer on the crossover interconnection substrate. In another embodiment the crossover is made via a crossover substrate flip chip bonded to an integrated circuit mounted on a multi-chip or multi-component interconnection substrate.