The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2004
Filed:
Jun. 12, 2001
Applicant:
Inventors:
Yinon Degani, Highland Park, NJ (US);
Thomas Dixon Dudderar, Chatham, NJ (US);
King Lien Tai, Berkeley Heights, NJ (US);
Assignee:
Lucent Technologies INC, Murray Hill, NJ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/166 ;
U.S. Cl.
CPC ...
H01L 2/166 ;
Abstract
The specification describes electrical testing strategies for multi-chip modules (MCMs). The MCMs are fabricated on double sided substrates, which are then solder bump bonded to a motherboard to form a BGA package. Untested chips are attached permanently to one side of the substrate to form a partially completed MCM package (PCMP), and the PCMPs are tested. PCMPs that pass are then completed by assembling known good die on the other side of the substrate.