EPO Patents = 3 (Patent Applications = 4)

Average Co-Inventor Count = 2.5

ph-index = 22

Forward Citations = 2,095(Granted Patents)

Forward Citations (Not Self Cited) = 2,076(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Middlesex, NJ (US) (1998)
Middlesex County, NJ (US) (1999)
Highland Park, NJ (US) (1990 - 2012)

Company Filing History:

23 out of 9,364

Lucent Technologies Inc.

At&t Bell Laboratories

Agere Systems Guardian Corp.

Murata Manufacturing Co., Ltd.

patents

8. 2 out of 832,880

Other

patents

Years Active: 1990-2012

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Areas of Expertise:

RF Devices

Integrated Passive Devices

Flip-Bonded Dual-Substrate Inductor

Multi-Chip IC Packages

Solder Bonding

Testing Integrated Circuits

Micromechanical Devices

Flip Chip Packaging

High Performance IC Package

Compact Balun Transformers

Printed Circuit Cards

Optical Transmission Interconnection

56 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8102021 - RF devices (2012-01-24),

2. 8018027 - Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor (2011-09-13),

3. 7936043 - Integrated passive device substrates (2011-05-03),

4. 7795709 - Shielding noisy conductors in integrated passive devices (2010-09-14),

5. 7692511 - Compact balun transformers (2010-04-06),

6. 7382056 - Integrated passive devices (2008-06-03),

7. 7355264 - Integrated passive devices with high Q inductors (2008-04-08),

8. 7259077 - Integrated passive devices (2007-08-21),

9. 7170754 - SDIO memory and interface card (2007-01-30),

10. 7061258 - Testing integrated circuits (2006-06-13),

11. 6867607 - Membrane test method and apparatus for integrated circuit testing (2005-03-15),

12. 6734539 - Stacked module package (2004-05-11),

13. 6680212 - Method of testing and constructing monolithic multi-chip modules (2004-01-20),

14. 6678167 - High performance multi-chip IC package (2004-01-13),

15. 6597069 - Flip chip metallization (2003-07-22),

Title: The Innovative Journey of Yinon Degani

Introduction: Yinon Degani, a talented inventor hailing from Highland Park, NJ (US), has made significant contributions to the field of innovations with his creative mind and dedication to problem-solving.

Latest Patents: Yinon Degani's latest patents showcase his commitment to pushing the boundaries of technology and improving everyday life. His recent inventions focus on sustainability and efficiency in energy consumption.

Career Highlights: With a career spanning over two decades, Yinon Degani has established himself as a prominent figure in the world of inventions. His work has been recognized for its ingenuity and practicality, earning him numerous accolades and awards.

Collaborations: Throughout his career, Yinon Degani has collaborated with leading research institutions, universities, and companies to bring his ideas to life. His partnerships have been instrumental in turning his concepts into tangible products that benefit society.

Conclusion: Yinon Degani's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor. His contributions have not only transformed industries but have also inspired the next generation of inventors to think outside the box.

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3 patents (EPO):

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4 patents pending (EPO):

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