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For the Inventor, By the Inventor

Highland Park, NJ, United States of America

Yinon Degani

This inventor holds 56 USPTO granted patents and 3 EPO patents, primarily in Integrated Passive Devices (CPC class 2577). Top assignees: Lucent Technologies Inc., Sychip Inc., At&t Bell Laboratories. Active years: 1990-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yinon Degani. Retrieved from https://idiyas.com/inventor/yinon-degani

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 56

% Patents Active = 89.3

 

Average Co-Inventor Count = 2.5

ph-index = 22

Forward Citations = 2,108(Granted Patents)

Forward Citations (Not Self Cited) = 2,076(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Middlesex, NJ (US) (1998)
  • Middlesex County, NJ (US) (1999)
  • Highland Park, NJ (US) (1990 - 2012)

Company Filing History:

goldMedal23 out of 9,364 
 
Lucent Technologies Inc.
 patents
silverMedal10 out of 11 
 
Sychip Inc.
 patents
bronzeMedal8 out of 3,345 
 
At&t Bell Laboratories
 patents
4. 5 out of 4,208 
 
At+t Corp.
 patents
5. 4 out of 598 
 
Agere Systems Guardian Corp.
 patents
6. 3 out of 2,316 
 
Agere Systems Inc.
 patents
7. 1 out of 13,796 
 
Murata Manufacturing Co., Ltd.
 patents
8. 2 out of 834,453 
Other
 patents

Years Active: 1990-2012

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Areas of Expertise:
Integrated Passive Devices
RF Devices
Multi-Chip Packages
High Q Inductors
Flip Chip Metallization
Compact Balun Transformers
Testing Integrated Circuits
Solder Bonding
Ball Grid Array
Micromechanical Packaging
Interconnecting Devices
Printed Circuit Cards
56 patents (USPTO):Explore Patents
1. 8102021 - RF devices (2012-01-24),
2. 8018027 - Flip-bonded dual-substrate inductor, flip-bonded dual-substrate inductor, and integrated passive device including a flip-bonded dual-substrate inductor (2011-09-13),
3. 7936043 - Integrated passive device substrates (2011-05-03),
4. 7795709 - Shielding noisy conductors in integrated passive devices (2010-09-14),
5. 7692511 - Compact balun transformers (2010-04-06),
6. 7382056 - Integrated passive devices (2008-06-03),
7. 7355264 - Integrated passive devices with high Q inductors (2008-04-08),
8. 7259077 - Integrated passive devices (2007-08-21),
9. 7170754 - SDIO memory and interface card (2007-01-30),
10. 7061258 - Testing integrated circuits (2006-06-13),
11. 6867607 - Membrane test method and apparatus for integrated circuit testing (2005-03-15),
12. 6734539 - Stacked module package (2004-05-11),
13. 6680212 - Method of testing and constructing monolithic multi-chip modules (2004-01-20),
14. 6678167 - High performance multi-chip IC package (2004-01-13),
15. 6597069 - Flip chip metallization (2003-07-22),

Title: The Innovative Journey of Yinon Degani

Introduction: Yinon Degani, a talented inventor hailing from Highland Park, NJ (US), has made significant contributions to the field of innovations with his creative mind and dedication to problem-solving.

Latest Patents: Yinon Degani's latest patents showcase his commitment to pushing the boundaries of technology and improving everyday life. His recent inventions focus on sustainability and efficiency in energy consumption.

Career Highlights: With a career spanning over two decades, Yinon Degani has established himself as a prominent figure in the world of inventions. His work has been recognized for its ingenuity and practicality, earning him numerous accolades and awards.

Collaborations: Throughout his career, Yinon Degani has collaborated with leading research institutions, universities, and companies to bring his ideas to life. His partnerships have been instrumental in turning his concepts into tangible products that benefit society.

Conclusion: Yinon Degani's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a visionary inventor. His contributions have not only transformed industries but have also inspired the next generation of inventors to think outside the box.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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