The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2008
Filed:
Sep. 13, 2006
Yinon Degani, Highland Park, NJ (US);
Yinchao Chen, Columbia, SC (US);
Yu Fan, Dallas, TX (US);
Charley Chunlei Gao, Plano, TX (US);
Kunquan Sun, Plano, TX (US);
Liquo Sun, Plano, TX (US);
Yinon Degani, Highland Park, NJ (US);
Yinchao Chen, Columbia, SC (US);
Yu Fan, Dallas, TX (US);
Charley Chunlei Gao, Plano, TX (US);
Kunquan Sun, Plano, TX (US);
Liquo Sun, Plano, TX (US);
Sychip Inc., Plano, TX (US);
Abstract
The specification describes flip bonded dual substrate inductors wherein a portion of the inductor is constructed on a base IPD substrate, a mating portion of the inductor is constructed on a cover (second) substrate. The cover substrate is then flip bonded to the base substrate, thus mating the two portions of the inductor. Using this approach, a two level inductor can be constructed without using a multilevel substrate. Using two two-level substrates yields a four-level flip bonded dual substrate inductor.