The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 28, 2001

Filed:

Apr. 09, 1997
Applicant:
Inventors:

Thaddeus John Gabara, Murray Hill, NJ (US);

King Lien Tai, Berkeley Heights, NJ (US);

Assignee:

Agere Systems Guardian Corp., Orlando, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/348 ;
U.S. Cl.
CPC ...
H01L 2/348 ;
Abstract

A multi-chip module (“MCM”) and methods of operation and manufacture thereof The MCM includes: (1) a substrate for supporting a plurality of separate integrated circuit (IC) chips thereon, (2) first and second separate IC chips mounted on the substrate, the first separate IC chip including first and second circuit portions coupled together by at least one signal conductor, and (3) interconnecting means that directly couples at least one signal conductor of the first separate IC chip to the second separate IC chip, the interconnecting means bypassing the second circuit portion of the first separate IC chip.


Find Patent Forward Citations

Gabara, Thaddeus. (2001). Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module (U.S. Patent No. 6281590). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6281590

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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