Puchong, Malaysia

Khang Choong Yong

USPTO Granted Patents = 54 

 

Average Co-Inventor Count = 4.9

ph-index = 3

Forward Citations = 41(Granted Patents)

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Inventors with similar research interests:


Location History:

  • Puching, MY (2021)
  • Puchong, MY (2016 - 2024)

Company Filing History:


Years Active: 2016-2024

where 'Filed Patents' based on already Granted Patents

54 patents (USPTO):

Title: Khang Choong Yong: A Pioneer in Patent Innovation

Introduction: Khang Choong Yong, a prolific inventor based in Puchong, Malaysia, has made significant contributions to the field of technology with an impressive portfolio of 54 patents. His innovations primarily focus on advanced electronic packaging and signal transmission systems, showcasing his expertise in integrating complex logic components into miniaturized platforms.

Latest Patents: Khang Choong Yong's latest patents include groundbreaking technologies, such as:

1. **Integrating System in Package (SiP) with Input/Output (IO) Board for Platform Miniaturization** - This invention describes methods and apparatus related to integrating a System in Package (SiP) with an Input/Output (IO) board, aimed at enhancing platform miniaturization. The SiP board incorporates a multitude of logic components, strategically positioned on both sides, with the IO board connecting via a grid array. This innovative design allows for improved functionality within a compact space.

2. **Self-Equalized and Self-Crosstalk-Compensated 3D Transmission Line Architecture** - This patent introduces a sophisticated package substrate method that includes a dielectric over a conductive layer with a conductive line on the dielectric. Notable features are the array of conductive bumps that enhance high-speed single-ended signal transmission, enabling efficient communication through thoughtfully integrated design elements.

Career Highlights: Throughout his career, Khang Choong Yong has worked at renowned companies, including Intel Corporation. His role at Intel allowed him to develop and refine his patented technologies, pushing the boundaries of innovation in electronic systems.

Collaborations: Khang has collaborated with talented colleagues, including Wil Choon Song and Eng Huat Goh. Their teamwork has been pivotal in the advancement of their shared projects, further driving innovation in the industry.

Conclusion: Khang Choong Yong’s extensive patent portfolio and cutting-edge technology developments exemplify his commitment to pushing the limits of innovation. His work not only influences the realm of electronic packaging but also sets a benchmark for future advancements in the industry.

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