The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Aug. 31, 2020
Intel Corporation, Santa Clara, CA (US);
Chee Ling Wong, Sungai Ara, MY;
Wil Choon Song, Bayan Lepas, MY;
Khang Choong Yong, Puchong, MY;
Eng Huat Goh, Ayer Itam, MY;
Mohd Muhaiyiddin Bin Abdullah, Kepala Batas, MY;
Tin Poay Chuah, Bayan Baru, MY;
Intel Corporation, Santa Clara, CA (US);
Abstract
A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.