Company Filing History:
Years Active: 2019-2022
Title: Chee Ling Wong: Innovator in Board-to-Board Interconnect Technology
Introduction
Chee Ling Wong is a notable inventor based in Sungai Ara, Malaysia. He has made significant contributions to the field of electronics, particularly in the development of innovative interconnect systems. With a total of 3 patents to his name, Wong continues to push the boundaries of technology.
Latest Patents
One of Wong's latest patents is a system for board-to-board interconnect. This system includes a first printed circuit board (PCB) that features a first recess along its edge, exposing a first solder pad. Additionally, a second PCB is designed with a complementary recess that exposes a second solder pad. This innovative design allows the two PCBs to mate seamlessly, ensuring that the solder pads align perfectly when connected. The system also includes an assembly that electronically couples the two solder pads, enhancing the efficiency of electronic connections.
Career Highlights
Wong is currently employed at Intel Corporation, where he applies his expertise in electronics and innovation. His work at Intel has allowed him to collaborate with some of the brightest minds in the industry, further advancing his contributions to technology.
Collaborations
Some of his notable coworkers include Wil Choon Song and Khang Choong Yong. Their collaborative efforts have played a crucial role in the development of cutting-edge technologies within the company.
Conclusion
Chee Ling Wong is a distinguished inventor whose work in board-to-board interconnect technology exemplifies innovation in the electronics field. His contributions continue to impact the industry positively, showcasing the importance of creativity and collaboration in technological advancement.