Intel Corporation

Chee Ling Wong

Eng Huat Goh

Khang Choong Yong

Tin Poay Chuah

Wil Choon Song

Mohd Muhaiyiddin Bin Abdullah

A system for board-to-board interconnect is described herein. The system includes a first printed circuit board (PCB) having a first recess along a first edge of the first PCB that exposes a first solder pad on a layer of the first PCB. The system also includes a second PCB having a second recess along a second edge of the second PCB that exposes a second solder pad on a layer of the second PCB. The second recess is complementary to the first recess to allow the first PCB to mate with the second PCB. The first solder pad is aligned with the second solder pad when the first PCB is mated with the second PCB. The system additionally includes an assembly configured to electronically couple the first solder pad with the second solder pad.

Growing community of inventors

Sungai Ara, Malaysia

Chee Ling Wong