The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 28, 2021

Filed:

Nov. 21, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Eng Huat Goh, Ayer Itam, MY;

Min Suet Lim, Gelugor, MY;

Boon Ping Koh, Seberang Jaya, MY;

Wil Choon Song, Bayan Lepas, MY;

Khang Choong Yong, Puchong, MY;

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 13/18 (2006.01); H01Q 1/38 (2006.01); H01Q 1/48 (2006.01); H01Q 21/28 (2006.01);
U.S. Cl.
CPC ...
H01Q 13/18 (2013.01); H01Q 1/38 (2013.01);
Abstract

Embodiments herein disclose techniques for apparatuses and methods for making a slot antenna on a PCB with a cutout. A PCB may include a metal layer. The metal layer may include a cavity to be a first radiating element of an antenna, and a slot to be a second radiating element of the antenna. In addition, the cavity may extend to be the cutout of the PCB through other layers of the PCB. The first and second radiating elements may provide a determined transmission frequency for the antenna. The metal layer may further include a portion of a transmission line of the antenna, and the transmission line is in contact with the cavity and the slot. A package may be affixed to the PCB, where a portion of the package may be within the cutout of the PCB. Other embodiments may be described and/or claimed.


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