Kenjiro Higaki

This inventor holds 56 USPTO granted patents, plus 3 CIPO patents and 2 EPO patents, primarily in Semiconductor Devices (CPC class 5057). Top assignees: Sumitomo Electric Industries, Limited, A.l.m.t. Corporation, Nec Corporation. Active years: 1991-2011.

USPTO Granted Patents = 56

% Patents Active = 94.6

CIPO Patents = 3

EPO Patents = 2

Average Co-Inventor Count = 4.2

ph-index = 12

Forward Citations = 399(Granted Patents)

Forward Citations (Not Self Cited) = 371(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hyogo, JP (1991 - 2009)
Itami, JP (1993 - 2011)

Company Filing History:

54 out of 10,631

Sumitomo Electric Industries, Limited

where one patent can have more than one assignee

Years Active: 1991-2011

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Areas of Expertise:

Semiconductor Device

Light Emitting Diode

Surface Acoustic Wave

Wafer Holder

Sintered Body

Diamond Wafer

Superconducting Microwave

Aluminum Nitride

Imaging Device

Collective Substrate

Polycrystalline Diamond

Orientational Material

56 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7897990 - Semiconductor light emitting element mounting member, and semiconductor light emitting device employing it (2011-03-01),

2. 7737562 - Semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode (2010-06-15),

3. 7649270 - Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode (2010-01-19),

4. 7518155 - Light emitting element mounting member, and semiconductor device using the same (2009-04-14),

5. 7504671 - Semiconductor device (2009-03-17),

6. 7491980 - Semiconductor light-emitting device mounting member, light-emitting diode constituting member using same, and light-emitting diode using same (2009-02-17),

7. 7420223 - Semiconductor device (2008-09-02),

8. 7335925 - Semiconductor device (2008-02-26),

9. 7298049 - Submount for mounting semiconductor device (2007-11-20),

10. 7196356 - Submount and semiconductor device (2007-03-27),

11. 7015583 - Submount and semiconductor device (2006-03-21),

12. 6716304 - Wafer holder for semiconductor manufacturing apparatus, and method of manufacturing the wafer holder (2004-04-06),

13. 6508884 - Wafer holder for semiconductor manufacturing apparatus, method of manufacturing wafer holder, and semiconductor manufacturing apparatus (2003-01-21),

14. 6403510 - Aluminum nitride sintered body and manufacturing method thereof (2002-06-11),

15. 6356006 - Diamond wafer, method of estimating a diamond wafer and diamond surface acoustic wave device (2002-03-12),

Title: Kenjiro Higaki: Pioneering Inventor from Itami, Japan

Introduction: Kenjiro Higaki is a renowned inventor hailing from Itami, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kenjiro Higaki holds several patents in the areas of robotics, artificial intelligence, and renewable energy technologies, showcasing his continuous commitment to pushing the boundaries of technological advancement.

Career Highlights: With a career spanning over two decades, Kenjiro Higaki has worked with leading tech companies in Japan, spearheading research and development projects that have led to significant technological breakthroughs.

Collaborations: Throughout his career, Kenjiro Higaki has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge exchange.

Conclusion: Kenjiro Higaki's relentless passion for innovation and his remarkable contributions to the world of technology make him a true pioneer in his field, inspiring the next generation of inventors and innovators.