The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2007
Filed:
Mar. 03, 2003
Teruo Amoh, Itami, JP;
Takashi Ishii, Itami, JP;
Kenjiro Higaki, Itami, JP;
Yasushi Tsuzuki, Itami, JP;
Teruo Amoh, Itami, JP;
Takashi Ishii, Itami, JP;
Kenjiro Higaki, Itami, JP;
Yasushi Tsuzuki, Itami, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A submount that enables the reliable mounting of a semiconductor light-emitting device on it, and a semiconductor unit incorporating the submount. A submountcomprises (a) a substrate; and (b) a solder layerformed on the top surfaceof the substrate. The solder layerbefore melting has a surface roughness, Ra, of at most 0.18 μm. It is more desirable that the solder layerbefore melting have a surface roughness, Ra, of at most 0.15 μm, yet more desirably at most 0.10 μm. A semiconductor unitcomprises the submountand a laser diodemounted on the solder layerof the submount