The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2009
Filed:
Oct. 30, 2007
Sadamu Ishidu, Itami, JP;
Kenjiro Higaki, Itami, JP;
Takashi Ishii, Itami, JP;
Yasushi Tsuzuki, Itami, JP;
Sadamu Ishidu, Itami, JP;
Kenjiro Higaki, Itami, JP;
Takashi Ishii, Itami, JP;
Yasushi Tsuzuki, Itami, JP;
Sumitomo Electric Industries, Ltd., Osaka-shi, JP;
Abstract
A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor deviceis equipped with a substrate, having a bottom surfaceand an element mounting surfacewhich is positioned on the opposite side of bottom surface, and a semiconductor element, having a main surfacewhich is mounted onto element mounting surface. With L being the length in the long direction of main surfaceand H being the distance between bottom surfaceand element mounting surface, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surfaceis a cavity, and elementis provided in cavity. A metal layeris provided on the surface of cavity. In addition, when an electrodewhich connects to an external part is provided on main surface, on the cavity side of the part which connects with electrode, main surfaceis provided with a groove. The groove is for preventing outward flow of connection memberof electrode