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For the Inventor, By the Inventor

Tokyo, Japan

A.l.m.t. Corporation

Calculating rank
USPTO Granted Patents = 86

% Expired Patents = 23.3



Trademarks = 3

Forward Citations = 169

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168 inventors (with patents filed for the assignee):

goldMedal Akihiko Ikegaya (11 out of 49 patents)

silverMedal Isao Iwayama (8 out of 9 patents)

bronzeMedal Masahiro Katoh (8 out of 8 patents)

4.  Yoshiharu Yamamoto (7 out of 13 patents)

5.  Kazuo Sasaya (6 out of 6 patents)

6.  Makoto Watanabe (5 out of 5 patents)

7.  Yoshitake Fukaya (5 out of 5 patents)

8.  Ayuri Tsuji (5 out of 5 patents)

9.  Shigekazu Yamazaki (5 out of 6 patents)

10.  Hideaki Morigami (5 out of 8 patents)

11.  Kouichi Takashima (5 out of 8 patents)

12.  Takayuki Fudo (4 out of 6 patents)

13.  Akihisa Hosoe (4 out of 58 patents)

14.  Makoto Yukawa (4 out of 4 patents)

15.  Hidenobu Nishino (4 out of 4 patents)


Core Competencies:
Composite Material
Semiconductor Package
Heat Spreader
Abrasive Tool
Cutting Tool
Diamond Die
Heat Sink
Tungsten Alloy
Super-Abrasive Wheel
Wire Saw
Crucible
Electrode Material

86 patents:

1. 12661866 - Composite material (2026-06-23),
2. 12654213 - Irregularly-shaped die (2026-06-16),
3. 12599975 - Rotary cutting tool (2026-04-14),
4. 12595980 - Composite member (2026-04-07),
5. 12525503 - Composite material, heat spreader and semiconductor package (2026-01-13),
6. 12503633 - Diamond composite material and heat radiating member (2025-12-23),
7. 12460281 - Tungsten-containing material and direct current discharge lamp electrode (2025-11-04),
8. 12451407 - Composite material, semiconductor package, and method of manufacturing composite material (2025-10-21),
9. 12428585 - Coated super-abrasive grains, abrasive grains, and wheel (2025-09-30),
10. 12415338 - Composite material (2025-09-16),
11. 12318828 - Wire drawing die (2025-06-03),
12. 12264384 - Composite material (2025-04-01),
13. 12252766 - Composite material, heat sink and semiconductor device (2025-03-18),
14. 12112993 - Heat radiation member (2024-10-08),
15. D1014588 - Rotary cutting tool (2024-02-13),
Company Overview
A.l.m.t. Corporation, headquartered in Tokyo, Japan, specializes in the development and manufacturing of advanced composite materials. The company focuses on innovative solutions for semiconductor packaging, heat spreaders, and various cutting tools, including abrasive tools and diamond dies. A.l.m.t. is recognized for its expertise in tungsten alloys and heat sinks, catering to industries that require high-performance materials and precision engineering. Their commitment to research and development positions them as a leader in the composite materials sector.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

A.l.m.t. Corporation USPTO Patent Assignee Logo
86 Patents

#601 in Tokyo

#1,241 in Japan

#8,873 in the World

Tokyo, JP
Tokyo, Japan

A.l.m.t. Corporation

Forward Citations = 169

168 inventors:

goldMedal Akihiko Ikegaya (11 out of 49 patents)

silverMedal Isao Iwayama (8 out of 9 patents)

bronzeMedal Masahiro Katoh (8 out of 8 patents)

4.  Yoshiharu Yamamoto (7 out of 13 patents)

5.  Kazuo Sasaya (6 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: A.l.m.t. Corporation. Retrieved from https://idiyas.com/company/a-l-m-t

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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