logo

For the Inventor, By the Inventor

Tokyo, Japan

A.l.m.t. Corporation


USPTO Granted Patents = 86

% Expired Patents = 23.3



Trademarks = 3

Forward Citations = 169

Loading Chart...
Loading Chart...

168 inventors (with patents filed for the assignee):

goldMedal Akihiko Ikegaya (11 out of 49 patents)

silverMedal Isao Iwayama (8 out of 9 patents)

bronzeMedal Masahiro Katoh (8 out of 8 patents)

4.  Yoshiharu Yamamoto (7 out of 13 patents)

5.  Kazuo Sasaya (6 out of 6 patents)

6.  Makoto Watanabe (5 out of 5 patents)

7.  Yoshitake Fukaya (5 out of 5 patents)

8.  Ayuri Tsuji (5 out of 5 patents)

9.  Shigekazu Yamazaki (5 out of 6 patents)

10.  Hideaki Morigami (5 out of 8 patents)

11.  Kouichi Takashima (5 out of 8 patents)

12.  Takayuki Fudo (4 out of 6 patents)

13.  Akihisa Hosoe (4 out of 58 patents)

14.  Makoto Yukawa (4 out of 4 patents)

15.  Hidenobu Nishino (4 out of 4 patents)


Core Competencies:
Composite Material
Semiconductor Package
Heat Spreader
Abrasive Tool
Cutting Tool
Diamond Die
Heat Sink
Tungsten Alloy
Super-Abrasive Wheel
Wire Saw
Crucible
Electrode Material

86 patents:

1. 12661866 - Composite material (2026-06-23),
2. 12654213 - Irregularly-shaped die (2026-06-16),
3. 12599975 - Rotary cutting tool (2026-04-14),
4. 12595980 - Composite member (2026-04-07),
5. 12525503 - Composite material, heat spreader and semiconductor package (2026-01-13),
6. 12503633 - Diamond composite material and heat radiating member (2025-12-23),
7. 12460281 - Tungsten-containing material and direct current discharge lamp electrode (2025-11-04),
8. 12451407 - Composite material, semiconductor package, and method of manufacturing composite material (2025-10-21),
9. 12428585 - Coated super-abrasive grains, abrasive grains, and wheel (2025-09-30),
10. 12415338 - Composite material (2025-09-16),
11. 12318828 - Wire drawing die (2025-06-03),
12. 12264384 - Composite material (2025-04-01),
13. 12252766 - Composite material, heat sink and semiconductor device (2025-03-18),
14. 12112993 - Heat radiation member (2024-10-08),
15. D1014588 - Rotary cutting tool (2024-02-13),
A.l.m.t. Corporation, headquartered in Tokyo, Japan, specializes in the development and manufacturing of advanced composite materials. The company focuses on innovative solutions for semiconductor packaging, heat spreaders, and various cutting tools, including abrasive tools and diamond dies. A.l.m.t. is recognized for its expertise in tungsten alloys and heat sinks, catering to industries that require high-performance materials and precision engineering. Their commitment to research and development positions them as a leader in the composite materials sector.
Profile summary based on public USPTO records.

logo

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

A.l.m.t. Corporation
86 Patents

#600 in Tokyo

#1,240 in Japan

#8,853 in the World

Tokyo, JP
Tokyo, Japan

A.l.m.t. Corporation

Forward Citations = 169

168 inventors:

goldMedal Akihiko Ikegaya (11 out of 49 patents)

silverMedal Isao Iwayama (8 out of 9 patents)

bronzeMedal Masahiro Katoh (8 out of 8 patents)

4.  Yoshiharu Yamamoto (7 out of 13 patents)

5.  Kazuo Sasaya (6 out of 6 patents)

Please report any incorrect information to [email protected]
Loading…