The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 08, 2024
Filed:
Aug. 30, 2019
Applicant:
A.l.m.t. Corp., Tokyo, JP;
Inventors:
Ryota Matsugi, Osaka, JP;
Isao Iwayama, Osaka, JP;
Chieko Tanaka, Toyama, JP;
Hideaki Morigami, Toyama, JP;
Assignee:
A.L.M.T. CORP., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); B23K 1/00 (2006.01); B23K 35/32 (2006.01); B23K 101/40 (2006.01); B23K 103/00 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3732 (2013.01); B23K 1/0016 (2013.01); B23K 35/325 (2013.01); H01L 23/3736 (2013.01); B23K 2101/40 (2018.08); B23K 2103/172 (2018.08); B23K 2103/56 (2018.08);
Abstract
A heat radiation member excellent in electrical insulation and better in thermal conduction is provided. The heat radiation member includes a substrate composed of a composite material containing diamond and a metallic phase, an insulating plate provided on at least a part of front and rear surfaces of the substrate and composed of an aluminum nitride, and a single bonding layer interposed between the substrate and the insulating plate, the heat radiation member having thermal conductivity not lower than 400 W/m·K.