The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Sep. 01, 2015
Applicant:

A.l.m.t. Corp., Tokyo, JP;

Inventors:

Tatsuya Morikawa, Toyama, JP;

Takanori Kadokura, Toyama, JP;

Kensuke Osawa, Toyama, JP;

Assignee:

A.L.M.T. Corp., Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); B22F 1/00 (2022.01); C22C 1/04 (2023.01); C22C 5/06 (2006.01); C22C 5/08 (2006.01); C22C 26/00 (2006.01); H01L 21/48 (2006.01); H01L 23/373 (2006.01); B22F 7/06 (2006.01); B22F 7/08 (2006.01); C22C 1/10 (2023.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); B22F 1/00 (2013.01); C22C 1/0466 (2013.01); C22C 5/06 (2013.01); C22C 5/08 (2013.01); C22C 26/00 (2013.01); H01L 21/4871 (2013.01); H01L 23/3732 (2013.01); H01L 23/3735 (2013.01); B22F 2007/066 (2013.01); B22F 7/08 (2013.01); B22F 2301/255 (2013.01); B22F 2302/05 (2013.01); B22F 2302/20 (2013.01); B22F 2302/406 (2013.01); B22F 2302/45 (2013.01); B22F 2304/10 (2013.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); C22C 1/1073 (2023.01); C22C 2026/005 (2013.01); C22C 2026/006 (2013.01); C22C 2026/007 (2013.01); C22C 2026/008 (2013.01);
Abstract

Provided are a diamond composite material which is excellent in thermal conductivity, suitable as a material for a heat radiating member, and dense, the heat radiating member, and a method for producing a diamond composite material that can productively produce a diamond composite material which is excellent in wettability between diamond and metal and dense. The diamond composite material includes: a coated diamond particle including a diamond particle and a carbide layer covering a surface of the diamond particle and including an element of group 4 of the periodic table; and silver or a silver alloy binding such coated diamond particles together, with an oxygen content of 0.1 mass % or less.


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