Company Filing History:
Years Active: 2024-2025
Title: Kensuke Osawa - Innovator in Diamond Composite Materials
Introduction
Kensuke Osawa is an inventor based in Toyama-shi, Japan. He is known for his work in developing advanced materials, particularly in the field of diamond composites. His innovative approach focuses on enhancing thermal conductivity and the production methods of these materials.
Latest Patent Applications
Kensuke Osawa has filed a patent application for a "DIAMOND COMPOSITE MATERIAL AND HEAT RADIATING MEMBER." This application describes a diamond composite material that excels in thermal conductivity, making it suitable for use as a heat radiating member. The material is characterized by its density and excellent wettability between diamond and metal. The composite includes coated diamond particles, which consist of a diamond particle covered by a carbide layer, and silver or a silver alloy that binds these particles together. The application emphasizes maintaining an oxygen content of 0.1 mass % or less.
Conclusion
Kensuke Osawa's contributions to the field of diamond composite materials highlight his innovative spirit and dedication to advancing material science. His work has the potential to impact various applications requiring efficient heat management.