The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2026
Filed:
Aug. 30, 2019
Applicant:
A.l.m.t. Corp., Tokyo, JP;
Inventors:
Ryota Matsugi, Osaka, JP;
Isao Iwayama, Osaka, JP;
Chieko Tanaka, Toyama, JP;
Hideaki Morigami, Toyama, JP;
Assignees:
Sumitomo Electric Industries, Ltd., Osaka, JP;
A.L.M.T. Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 21/08 (2006.01); B23K 35/30 (2006.01); C22C 5/08 (2006.01); C22C 26/00 (2006.01); H01L 23/373 (2006.01); H10W 40/25 (2026.01); B23K 101/40 (2006.01); B23K 103/08 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
F28F 21/089 (2013.01); B23K 35/3006 (2013.01); C22C 5/08 (2013.01); C22C 26/00 (2013.01); H10W 40/255 (2026.01); B23K 2101/40 (2018.08); B23K 2103/08 (2018.08); B23K 2103/16 (2018.08);
Abstract
A composite member having an excellent heat resistance is provided. The composite member includes: a substrate composed of a composite material including a non-metal phase and a metal phase; and a metal layer that covers at least a portion of a surface of the substrate, wherein a metal included in each of the metal phase and the metal layer is mainly composed of Ag, and a ratio of a content of Cu to a total content of Ag and Cu in a boundary region of the metal layer with the substrate is less than or equal to 20 atomic %.