The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2009

Filed:

Aug. 18, 2004
Applicants:

Kenjiro Higaki, Hyogo, JP;

Sadamu Ishidu, Hyogo, JP;

Teruo Amoh, Hyogo, JP;

Yasushi Tsuzuki, Hyogo, JP;

Inventors:

Kenjiro Higaki, Hyogo, JP;

Sadamu Ishidu, Hyogo, JP;

Teruo Amoh, Hyogo, JP;

Yasushi Tsuzuki, Hyogo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor-light-emitting-device-mounting member BL comprises (a) a highly heat-dissipative memberhaving a main surfaceon which connecting-use electrode layersandare provided to form a device-mounting areaand (b) a frame-shaped memberplaced on the main surfaceso as to surround the device-mounting area. The device-mounting areahas an area that is 1.05 to 4 times the area of a semiconductor light-emitting device LE. A light-emitting-diode-constituting member LEmounts a semiconductor light-emitting device LEon the device-mounting areaof the semiconductor-light-emitting-device-mounting member BL and has a fluorescent body and/or a protective resin LR filling the inside space of the frame-shaped member. A light-emitting diode LEmounts the light-emitting-diode-constituting member LEon a package


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