The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2007
Filed:
Jul. 30, 2003
Takashi Ishii, Itami, JP;
Kenjiro Higaki, Itami, JP;
Yasushi Tsuzuki, Itami, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
The present invention provides a submount that allows a semiconductor light-emitting element to be attached with a high bonding strength. A submountis equipped with a substrateand a solder layerformed on a primary surfaceof the substrate. The density of the solder layeris at least 50% and no more than 99.9% of the theoretical density of the material used in the solder layer. The solder layercontains at least one of the following list: gold-tin alloy; silver-tin alloy; and lead-tin alloy. The solder layerbefore it is melted is formed on the substrateand includes an Ag filmand an Sn filmformed on the Ag film. The submountfurther includes an Au filmformed between the substrateand the solder layer