Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

Abstract

A collective substrate () is produced by firing a ceramic green sheet and forming through-holes () in the resulting substrate. The through-holes () each have an interior surface including taper surfaces () which are tapered as having an opening size progressively decreasing from a main surface () and an external connection surface () toward a minimum size hole portion (). The taper surfaces () respectively form obtuse angles θ, θwith the main surface () and the external connection surface (). A semiconductor element mount (BL) includes an insulative member () cut out of the collective substrate (). An imaging device (PE) includes an imaging element (PE) mounted in a region surrounded by a frame () which is bonded to the main surface () of the insulative member () and closed by a cover (FL). A light emitting diode component (LE) includes a light emitting element (LE) mounted on the main surface () of the insulative member () with the minimum size hole portion () of the through-hole being filled with an electrically conductive material (), the light emitting element being sealed with a fluorescent material and/or a protective resin (FR). A light emitting diode (LE) includes the light emitting diode component (LE) mounted in a package ().