Company Filing History:

21 out of 29,232

Texas Instruments Corporation

Texas Instruments Japan Limited

patents

4. 1 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 1993-2012

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24 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 8298874 - Packaged electronic devices having die attach regions with selective thin dielectric layer (2012-10-30),

2. 8222748 - Packaged electronic devices having die attach regions with selective thin dielectric layer (2012-07-17),

3. 8115310 - Copper pillar bonding for fine pitch flip chip devices (2012-02-14),

4. 7679002 - Semiconductive device having improved copper density for package-on-package applications (2010-03-16),

5. 7344916 - Package for a semiconductor device (2008-03-18),

6. 7157363 - Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion (2007-01-02),

7. 7023088 - Semiconductor package, semiconductor device and electronic device (2006-04-04),

8. 7005719 - Integrated circuit structure having a flip-chip mounted photoreceiver (2006-02-28),

9. 6992380 - Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area (2006-01-31),

10. 6929971 - Semiconductor device and its manufacturing method (2005-08-16),

11. 6894374 - Semiconductor package insulation film and manufacturing method thereof (2005-05-17),

12. 6876077 - Semiconductor device and its manufacturing method (2005-04-05),

13. 6875637 - Semiconductor package insulation film and manufacturing method thereof (2005-04-05),

14. 6835595 - Semiconductor package, semiconductor device, electronic device, and method of manufacturing semiconductor package (2004-12-28),

15. 6830956 - Method for packaging a low profile semiconductor device (2004-12-14),

Title: Kenji Masumoto: A Pioneer in Packaged Electronic Device Innovations

Introduction

Kenji Masumoto, based in Hiji-machi, Japan, is an esteemed inventor known for his significant contributions to the field of packaged electronic devices. With a remarkable portfolio of 24 patents, Masumoto continues to shape the future of electronic packaging technologies.

Latest Patents

Masumoto's latest innovations include groundbreaking patents focusing on the formation of packaged electronic devices with selective thin dielectric layers. His recent patents outline methods for creating a package substrate that features a top substrate surface inclusive of a die attach region with at least one land pad. Notably, these devices utilize layers of dielectric material strategically placed to optimize performance. The intricacy of these designs not only advances the technology but also enhances the functionality and reliability of integrated circuits mounted within these packages. These patents exemplify Masumoto's dedication to pushing the boundaries of electronic device engineering.

Career Highlights

Throughout his career, Kenji Masumoto has worked with prominent companies such as Texas Instruments Corporation and Fujikura Limited. His expertise in electronic packaging has paved the way for numerous innovations, establishing him as a leading figure in the industry. His work at these esteemed organizations allowed him to further refine his skills and contribute significantly to the advancement of technology.

Collaborations

In his journey as an inventor, Masumoto has collaborated with notable professionals in the field, including Mutsumi Masumoto and Masatoshi Inaba. These partnerships have not only enriched his own work but have also fostered collaborative efforts that have strengthened the technological landscape of electronic devices.

Conclusion

Kenji Masumoto's dedication to innovation in packaged electronic devices has secured his legacy as a pioneering inventor. With his extensive patent portfolio and impactful collaborations, he continues to influence the development of cutting-edge electronic technologies. His contributions remain vital in driving forward the capabilities and efficiencies of electronic packaging solutions.

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