The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 17, 2012
Filed:
Sep. 21, 2009
Bernardo Gallegos, The Colony, TX (US);
Kenji Masumoto, Oita-Pref, JP;
Bernardo Gallegos, The Colony, TX (US);
Kenji Masumoto, Oita-Pref, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A packaged electronic device including a package substrate having a top substrate surface including a die attach region including at least one land pad thereon and a first dielectric layer positioned lateral to the land pad and a non-die attach region. The non-die attach region includes a second dielectric layer, wherein a thickness of the second dielectric layer is>a thickness of the first dielectric layer by at least 5 μm. An IC die has a top semiconductor surface including active circuitry and at least one bonding conductor formed on the top semiconductor surface, and a bottom surface, wherein the bonding conductor of the IC die is joined to the land pad of the package substrate. An underfill layer is between the IC die and the die attach region.