The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 04, 2006
Filed:
May. 21, 2003
Takanao Suzuki, Koto-ku, JP;
Masatoshi Inaba, Koto-ku, JP;
Tadanori Ominato, Koto-ku, JP;
Masahiro Kaizu, Koto-ku, JP;
Akihito Kurosaka, Koto-ku, JP;
Masatoshi Inaba, Koto-ku, JP;
Nobuyuki Sadakata, Koto-ku, JP;
Mutsumi Masumoto, Hayami-gun, JP;
Kenji Masumoto, Hiji-machi, JP;
Takanao Suzuki, Koto-ku, JP;
Masatoshi Inaba, Koto-ku, JP;
Tadanori Ominato, Koto-ku, JP;
Masahiro Kaizu, Koto-ku, JP;
Akihito Kurosaka, Koto-ku, JP;
Masatoshi Inaba, Koto-ku, JP;
Nobuyuki Sadakata, Koto-ku, JP;
Mutsumi Masumoto, Hayami-gun, JP;
Kenji Masumoto, Hiji-machi, JP;
Fujikura Ltd., Tokyo, JP;
Texas Instruments Japan Limited, Tokyo, JP;
Abstract
An insulating layer () having an opening portion () at a position conformable to an electrode pad () is formed. Next, a resin projection portion () is formed on the insulating layer (). Thereafter, a resist film is formed which has opening portions made in regions conformable to the opening portion (), the resin projection portion () and the region sandwiched therebetween. A Cu plating layer () is formed by electrolytic copper plating, using the resist film as a mask.