Tokyo, Japan

Nobuyuki Sadakata



Average Co-Inventor Count = 6.5

ph-index = 9

Forward Citations = 226(Granted Patents)


Location History:

  • Koto-ku, JP (2006)
  • Tokyo, JP (1986 - 2007)

Company Filing History:


Years Active: 1986-2007

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14 patents (USPTO):

Title: Nobuyuki Sadakata: Innovator in Semiconductor Technology

Introduction

Nobuyuki Sadakata is a prominent inventor based in Tokyo, Japan, known for his significant contributions to semiconductor technology. With a total of 14 patents to his name, he has made remarkable advancements in the field, particularly in the production of semiconductor packages.

Latest Patents

Sadakata's latest patents include a method for producing a semiconductor package that features a rerouted electrode formed on a resin projection portion. This innovative process involves creating an insulating layer with an opening conformable to an electrode pad. Following this, a resin projection portion is formed on the insulating layer. A resist film is then applied, which has opening portions made in regions conformable to the previously mentioned components. Finally, a copper plating layer is formed through electrolytic copper plating, utilizing the resist film as a mask. Another notable patent involves a semiconductor device and electronic device, which follows a similar method of construction.

Career Highlights

Throughout his career, Nobuyuki Sadakata has worked with esteemed companies such as Fujikura Limited and Texas Instruments Japan Limited. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.

Collaborations

Sadakata has collaborated with notable colleagues, including Osamu Kohno and Yoshimitsu Ikeno, further enhancing his work in the field.

Conclusion

Nobuyuki Sadakata's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in electronic devices and semiconductor packaging.

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