The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 14, 2004
Filed:
Aug. 13, 2002
Mutsumi Masumoto, Beppu, JP;
Kenji Masumoto, Hayami-gun, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A method to realize low-profile semiconductor devices by grinding a resin sealed block and realize level grinding by eliminating warpage of the resin sealed block. Semiconductor devices are produced by step (B) in which multiple semiconductor chips are mounted face down onto the surface of substrate , step (C) in which molding resin is injected onto substrate in order to form resin sealed block in which multiple semiconductor chips are sealed, step (E) in which resin sealed block is cut halfway from the side of substrate , and step (F) in which resin sealed block is ground from the side of molding resin in order to separate it into individual semiconductor devices