The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 31, 2006
Filed:
Aug. 29, 2003
Kenji Masumoto, Hiji-machi, JP;
Kenji Masumoto, Hiji-machi, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A semiconductor device. The device includes an interposerhaving two major surfaces. The first surfaceincludes patterned metal conductors and bond pads, and the second surface includes an array of solder balls. The device includes a semiconductor chiphaving a top surface and a back surface, the back surface of the chip adjacent the interposer, and the top surface including a plurality of terminals. Also included is a layer of polymeric materialdisposed on the first surfaceof the interposer covering the area of the interposer over the solder ball array. At least a portion of the polymeric material layer is between the chipand the interposer. The device further includes a plurality of electrical connectionsbetween the chip terminals and the bond padson the interposer.