The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 30, 2012
Filed:
Jun. 18, 2012
Applicants:
Bernardo Gallegos, The Colony, TX (US);
Kenji Masumoto, Hayami-Gun, JP;
Inventors:
Bernardo Gallegos, The Colony, TX (US);
Kenji Masumoto, Hayami-Gun, JP;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method for forming a packaged electronic device including a package substrate having a top substrate surface including a die attach region including at least one land pad thereon and a first dielectric layer positioned lateral to the land pad and a non-die attach region. A second dielectric layer is formed on the top substrate surface of the package substrate. An IC die which is mounted to the top substrate surface of the package substrate. An underfill layer is formed between the IC die and the die attach region.